Introduction
Paragon Technology
Established in 1995 and headquartered in Taoyuan, Paragon Technology (Taiwan Stock Exchange: 3518) is the world’s first manufacturer to successfully applParagon Technology Physical Vapor Deposition (PVD) technology to electromagnetic interference (EMI/ESD) shielding solutions for 3C products, establishing a solid foundation in the global electronics supply chain.
Driven by the explosive growth of high-end chips and AI computing, Paragon Technology has successfully transformed into a leading supplier of advanced semiconductor materials and core process equipment. Leveraging our dual-track R&D capabilities in “Critical Materials & Proprietary Equipment,” we have mastered large-size SiC substrate production and successfully developed advanced substrate PVD seed layer technologies. Moving forward, Paragon Technology is strategically focused on key semiconductor sectors:
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- Core Advanced Packaging Technologies
We actively deploy advanced PVD process technologies to provide critical titanium-copper (Ti/Cu) seed layer process services. Our solutions support a wide range of applications, including HDI substrates, ABF substrates, Through-Glass Via (TGV), CPO optical substrates, and Through-Silicon-Carbide Via (TSiCV). - Silicon Carbide (SiC) Thermal Management Solutions
Paragon Technology has deeply integrated into the SiC supply chain, with our Chiayi plant in Taiwan featuring a fully integrated, turnkey process from crystal growth to substrate production. To overcome the thermal bottlenecks of high-power AI computing, we provide SiC substrates and wafer-level microfluidics cooling technologies, solving industry pain points with high-value, one-stop solutions.
- Core Advanced Packaging Technologies
Paragon Technology will continue to deepen its cross-domain R&D capabilities. By combining the dual advantages of advanced PVD coating and SiC materials, we precisely align with the future demands of high-power components and advanced packaging markets, delivering highly efficient, high-value technical and process equipment integration services to global semiconductor and AI supply chain partners.
