Paragon Technology
Established in 1995 and headquartered in Taoyuan, Paragon Technology (Taiwan Stock Exchange: 3518) is the world’s first manufacturer to successfully applParagon Technology Physical Vapor Deposition (PVD) technology to electromagnetic interference (EMI/ESD) shielding solutions for 3C products, establishing a solid foundation in the global electronics supply chain.
Driven by the explosive growth of high-end chips and AI computing, Paragon Technology has successfully transformed into a leading supplier of advanced semiconductor materials and core process equipment. Leveraging our dual-track R&D capabilities in “Critical Materials & Proprietary Equipment,” we have mastered large-size SiC substrate production and successfully developed advanced substrate PVD seed layer technologies. Moving forward, Paragon Technology is strategically focused on key semiconductor sectors:
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- Core Advanced Packaging Technologies
We actively deploy advanced PVD process technologies to provide critical titanium-copper (Ti/Cu) seed layer process services. Our solutions support a wide range of applications, including HDI substrates, ABF substrates, Through-Glass Via (TGV), CPO optical substrates, and Through-Silicon-Carbide Via (TSiCV).
- Silicon Carbide (SiC) Thermal Management Solutions
Paragon Technology has deeply integrated into the SiC supply chain, with our Chiayi plant in Taiwan featuring a fully integrated, turnkey process from crystal growth to substrate production. To overcome the thermal bottlenecks of high-power AI computing, we provide SiC substrates and wafer-level microfluidics cooling technologies, solving industry pain points with high-value, one-stop solutions.
Paragon Technology will continue to deepen its cross-domain R&D capabilities. By combining the dual advantages of advanced PVD coating and SiC materials, we precisely align with the future demands of high-power components and advanced packaging markets, delivering highly efficient, high-value technical and process equipment integration services to global semiconductor and AI supply chain partners.
International Semiconductor Exhibition Information
SEMICON Taiwan
We would like to adjust the highlighted text in the image as follows: SEMICON Taiwan is the most influential semiconductor event in Taiwan, reaching records high in terms of scale in its 30-years of history, attracting 1,200 exhibitors, using total 4,100 booths, and organizing over 20 international forums. This year will spotlight eight key industry […]
High Aspect-Ratio Glass-Substrate Via-Fill Electroplating and Inspection Technology
ITRI’s “High Aspect-Ratio Glass-Substrate Via-Fill Electroplating and Inspection Technology” effectively increases electrode density and improves chip stacking, helping Taiwan’s semiconductor industry continue to lead. The image depicts advanced fan-out packaging—a domain where this technology can be applied. Glass-Interposer technology brings 2D-to-3D advanced packaging with more stable yields and more competitive cost. As semiconductor processes continue […]
Technology Trends in AI Packaging Materials
As demand for AI computing continues to surge, chip design is moving toward higher bandwidth, lower latency, and greater integration, making packaging technology a critical determinant of AI hardware performance. Die-to-die interconnect technologies—Redistribution Layers (RDL), hybrid bonding, and Through-Silicon Vias (TSV)—not only boost signal transmission efficiency and density but also enable multi-die architectures in high-performance […]
Industry Technology and Application Trends of Silicon Carbide Modules
Silicon-based power devices and modules are reaching a performance ceiling in high-power applications, prompting scientists to explore materials and technologies among compound semiconductors. Silicon carbide (SiC) offers a wide bandgap, high breakdown voltage, high thermal conductivity, high electrical insulation, and high power density, providing fast switching, high-temperature tolerance, and high-voltage capability for electronic devices. It […]